Rockwell Collins Printed Circuits' vision is to keep our customers prepared for the future, by working together to deliver printed circuits board solutions through service, information and technology. We offer products and processes that satisfy the highest standards of the military, telecommunications and instrumentation industries. Over 40 year history of world-class manufacturing and quality is your assurance that Rockwell Collins Printed Circuits will meet your exacting specifications.

You can rely on Rockwell Collins Printed Circuits to be your trusted printed circuit board (PCB) fabrication resource. We work to help develop, transition, and manufacture PCBs that deliver on-time, industry leading quality and add total value. Our engineering and manufacturing teams smoothly transition your PCB order to help you meet your time-to-market objectives.

Our addressed market is primarily multi-layer boards 8-30 layers, low to medium volume; with technologies such as blind and buried vias, heavy copper, controlled impedance, copper invar copper and heatsink assemblies. The only exception is the RF/Microwave market requiring the use of Teflon, Duroid®, or TMM® substrates, as we will produce boards from 2-12 layers, low to high volume. We are a qualified supplier of hi-rel boards to such specifications as UL-94V-0 and MIL-PRF-55110. Our current certifications include ISO 9001:2000 and ISO 14001. In addition, we are compliant to IPC-6012 and IPC 6018. Our experience in the use of various laminate materials includes FR-4, BT, Polyimide, Teflon, Duroid®, TMM®, RO4000® Series, Cyanate Ester, GETEK®, Heavy Copper, Power Teflon®, and Mixed Dielectrics.